RoHS (Pb-Free) Overview

In December 2002, the European Union Parliament approved the content of two directives to better control the management of waste electronic equipment. The two directives are the Waste from Electrical and Electronic Equipment (WEEE) and the Restriction of Hazardous substances (RoHS). The WEEE directive (2002/96/EC) addresses the collection, recycling and recovery requirements of waste electronic equipment for the member countries and is part of a legislative initiative to address the problem of large amounts of toxic waste. The RoHS (2002/95/EC) directive restricts the use of specific materials contained in electronic products. The RoHS states that the targeted materials shall no longer be contained in the electronic products above certain limits unless there is an exemption provided in the rule.

Ecliptek RoHS (Pb-free) Program

The Ecliptek RoHS Compliance (Pb-free) program is implemented in accordance with European Union (EU) Legislation titled "Restriction of the use of certain Hazardous Substances (RoHS)" including banning the use of Lead (Pb) and five other materials in electronic assemblies after July 1, 2006. The Ecliptek Product RoHS Compliance Matrix below provides a listing of the RoHS and Pb-free classifications for all Ecliptek components and assemblies.

Ecliptek Definitions

RoHS Compliance Classification

Component and Assembly shall be compliant to Directive 2002/95/EC of the European Parliament and of the Council of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. These substances include Lead (Pb), mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB) or polybrominated diphenyl ethers (PBDE, including Deca-BDE).

RoHS Compliance Exemptions

Article 4, paragraph 1 of the RoHS directive references the restriction of the use of certain hazardous substances. Paragraph 2 of the directive references exemptions to these substances. Those exemptions applicable to Ecliptek product are referenced in paragraph 7 in the ANNEX Section as follows:

• Lead (Pb) in high melting temperature type solders (i.e. Lead-based solder alloys containing more than 85% Lead).

Pb-Free Classification

Component and Assembly Lead (Pb) content shall be less than 0.1% by weight of the device (in accordance to IPC/EIA J-STD-006), shall not be intentionally introduced, and shall be a homogeneous material that can not be mechanically disjoined into different materials.

Components

Ecliptek's definition of components apply to quartz crystal devices.

Assemblies

Ecliptek's definition of assemblies apply to oscillator devices (MEMS Oscillators, XO, VCXO, TCXO, and OCXO's).

Solder Composition

Ecliptek has qualified the following Pb-free solder composition recommended by the North American Electronics Manufacturing Initiative (NEMI) and IPC's Solder Product Value Council (SPVC): Sn95.5Ag3.9Cu0.6 and Sn96.5Ag3.0Cu0.5, respectively, for attachment of Ecliptek components and assemblies to the printed circuit board.

Part Number Identification

When applicable, the Ecliptek specification sheet shall indicate if the device is classified as RoHS Compliant or RoHS Compliant (Pb-free).

Process Compatibility

The Ecliptek specification sheet identifies the suggested solder reflow profile(s). All Ecliptek RoHS Compliant and RoHS Compliant (Pb-free) products are backwards compatible to lower temperature Tin-Lead (SnPb) reflow profile(s).

Marking and Labeling

Ecliptek has a Pb-free labeling method for the packaging of all RoHS Compliant and RoHS Compliant (Pb-free) products. The lowest level shipping container shall identify the products as Pb-free.

RoHS Compliant and RoHS Compliant (Pb-Free) 260C Solder Reflow Profile

Ecliptek RoHS Compliant and RoHS Compliant (Pb-Free) products shall be capable of withstanding the following solder reflow profile:

• SMD Components and Assemblies Reflow Methods
  • Infrared/Convection Reflow (per IPC/JEDEC J-STD-020)
    • Average ramp-up rate of 3C/second maximum
    • Pre-heat from 150C to 200C, 60 to 180 seconds
    • Time maintained above a reflow temperature of 217C, 60 to 150 seconds
    • Target Peak Temperature of 250C +0/-5C, 20 to 40 seconds
    • Peak Temperature of 260C maximum for 10 seconds maximum
    • Average ramp-down rate of 6C/second maximum
    • Time from 25C to Peak Temperature, 8 minutes maximum(One time)
  • Manual Solder Reflow
    • Target Peak Temperature of 250C +0/-5C, 5 to 10 seconds
    • Peak Temperature of 260C maximum for 10 seconds maximum
• Through-hole Components and Assemblies Reflow Methods
  • Wave Solder (Back of board Solder Bath Reflow)
    • Pre-heat from 150C to 200C, 60 to 180 seconds
    • Peak Temperature of 260C maximum for 10 seconds maximum (one time)
  • Manual Solder Reflow
    • Target Peak Temperature of 250C +0/-5C, 5 to 10 seconds
    • Peak Temperature of 260C maximum for 10 seconds maximum